IBM Unveils World's First Sub-1 Nanometer Chip Technology — 0.7nm Nanostack
IBM has announced a breakthrough in chip manufacturing with the world’s first sub-1 nanometer semiconductor technology, using a 0.7nm (7 angstrom) process built on a novel 3D nanostack transistor architecture where transistors are vertically stacked and offset from one another. The design can pack nearly 100 billion transistors on a chip the size of a fingernail — roughly double the density of IBM’s 2021 2nm node — delivering up to 50% higher performance, 70% better energy efficiency, and 40% SRAM scaling gains for AI workloads. The technology remains at the research stage, with IBM estimating production could begin within the next five years.